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semicon_india

A look in the 3d printed Semiconductor Fab. Source: Pfeiffer Vacuum+Fab Solutions.

Pfeiffer Vacuum+Fab Solutions at SEMICON India 2025

Pfeiffer Vacuum+Fab Solutions – a member of the global Busch Group – presented its comprehensive portfolio for the semiconductor industry at SEMICON India 2025, which took place from September 2 to 4 at the Yashobhoomi (India International Convention Centre) in New Delhi.

Over the three days of the trade show, visitors had the opportunity to exchange with experts from Pfeiffer Vacuum+Fab Solutions about vacuum pumps, contamination management solutions, leak detectors, valves, gas abatement systems, and comprehensive sub-fab management. In addition, the visitors could get up close to several products of particular interest for the semiconductor industry on display at the booth.

Wide range of solutions on display

The UltiDry P1820 multi-stage roots vacuum pump was a central feature of the booth. Engineered for optimal efficiency and reliability, the UltiDry meets the stringent requirements of the semiconductor industry. A holographic display accompanied the vacuum pump, vividly showcasing its energy-efficient capabilities in challenging semiconductor applications. Additionally, a spinning LED hologram featured an animated UltiDry mascot, catching the attention of passing visitors.

The new product Series E of electric angle valves was also presented. These have been developed for high vacuum applications and set an industry standard with superior control, energy efficiency, reliability, and significant cost savings. Series E offers an electric actuation system that is first in its class, designed for precision and robust performance. It features a failsafe mechanism to maintain safety during power losses and a local mode for manual operation during maintenance. This reduces mechanical stress and ensures consistent, safe performance. The valves are reliable for critical settings, ranging from 10-3 to 10-9 hPa (mbar).

As a representation of the gas abatement systems offered by Pfeiffer, a full-size mock-up of the CT-TW-H thermal-wet hybrid gas abatement system was on display at the booth. This system operates using hydrogen-injected combustion technology – an effective method for selectively destroying exhaust gases, particularly perfluorocarbons (PFCs). It delivers high uptime, robust environmental performance, and easy maintenance, all of which are critical for sustainable semiconductor manufacturing.

A look inside a semiconductor fab

Alongside the different technology, a 3D-printed semiconductor fab helped bring the process to life. This detailed and interactive scale model displayed at the booth shows an entire semiconductor manufacturing facility – from the clean room to the sub-fab. It served as a hands-on educational tool that displays how a semiconductor fab is structured and how it operates. This allowed visitors to get up close to each stage of the production process, allowing them to see the various vacuum and abatement technologies from the Busch Group and how these are integrated throughout the facility.